DFI CL630-CRM User Manual Page 1

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Summary of Contents

Page 1 - Haswell Workstation Solution

12014/7/231Revision Control • Long Product Life Cycle www.dfi.comHas

Page 2 - Power and Performance

10SpecificationsXEONDL310-C226 microATXProcessorIntelXeon E3-1200 v3 seriesChipsetIntel C226Memory4 DDR3/DDR3L DIMM up to 32GB, ECCDisplayHDMI, DVI-IL

Page 3

11Various PCIe Configurations 1/2PCIe x16PCIe x4PCIe x16Available ConfigurationsOption 11 PCIe 3.0 x16 (the other x16 is non-functional)1 PCIe 2.0 x41

Page 4 - Features

12Various PCIe Configurations 2/2PCIe x16PCIe x1PCIe x42 PCIe 3.0 x16 (2 x8 signal)1 PCIe 2.0 x41 PCIe 2.0 x1PCIe x16 Gen 3.0 Bandwidth up to 8GT/s pr

Page 5

13High Performance I/O 1/2Packed with High Performance I/O via the Intel®C226 Express Chipset10 USB • 4 USB 3.0: up to ten times faster than USB 2.0 f

Page 6

14High Performance I/O 2/212 USB • 4 USB 3.0: up to ten times faster than USB 2.0 for quicker data transfers and processing large-scale content handle

Page 7

15Display Outputs1 HDMI + 1 DVI-IHDMIIntegrated Intel graphics engine significantly improves graphics and media performance compared to prior-generati

Page 8

16Dual Intel Gigabit LANLAN1LAN2AMT 9.02 Gigabit LAN with Increased Transmission Speed for Network-Intensive Applications2 LAN doubles networking capa

Page 9

17SoftwareDFI UtilityWatchdog Timer FunctionHardware Health MonitorDigital I/OOS SupportWindows XP Professional x86 & SP3 (32-bit)Windows XP Profe

Page 10 - Specifications

18DFI Proprietary Technology

Page 11 - DL631-C226 ATX

193 modules for additional COM/Parallel ports via the LPC connector• EXT-6C1PR6 RS232 COM ports, 1 parallel portCOM/Parallel Extension Modules Desktop

Page 12 - DL310-C226 microATX

2Workstation PlatformThe Power and Performance of Intel Xeon E3-1200 v3 Processors onATX and microATX Industrial MotherboardsReliable and Durable: 24/

Page 13 - High Performance I/O 1/2

20COM/Parallel Extension Modules

Page 14 - High Performance I/O 2/2

21EXT-6C1PRPower cableConnecting the Module to the MotherboardThe photo above is an example of the LPC connector on the motherboard.LPC connectorUSB c

Page 15 - Display Outputs

22Mechanical DrawingDimensions: 101.1mm x 48.89mm (4” x 1.92”)Block DiagramTechnical InformationApplicable DFI MotherboardsATX: DL631-C226, HD631-Q87

Page 17 - Software

24Wide Range of Industrial ApplicationsIdeal for a wide range of intelligent systems including network appliance and other communication devices, digi

Page 18 - DFI Proprietary Technology

25DL310-C226Computed Tomography (CT) System+Wallmount Industrial Chassiswith 300W ATX powerMonitorx16 Graphicsx4/x1 Capture/LAN Industrial cameraPCIe

Page 19 - • EXT-4C1PR

26DL631-C226Machine Vision Functions+4U Rackmount with ATX powerMonitorx16 Graphicsx4 Capture/LAN Industrial cameraMotion Controller card; I/O cardVFD

Page 20

27Medical Record ManagementThe machine used for managing hospital information such as doctor’s appointment, tracking patient/customer payment, and ad

Page 21 - LPC connector

28DL631-C226Drug and Package Inspection+4U Rackmount with ATX powerMonitorx16 Graphicsx4 Capture/LAN Industrial cameraMotion Controller card; I/O card

Page 23 - Applications

3Workstation PlatformIvy Bridge CL630-CRM (ATX)HaswellDL631-C226 (ATX) DL310-C226 (microATX)  Intel Xeon E3-1200 v2 Series Intel C216 Chipset 4 D

Page 24

30MTBFUp to 60oCCapable of operating in a 0~60oC environment; generally higher than most regular Xeon motherboardsDesktopHigh Computing Performance Yo

Page 25 - DL310-C226

31Supported Processors 1/3Generation Intel®Xeon®and Intel®CoreTMProcessorsIntel® C226 Express chipset22nm process technologyDesktopXEONIntel® Xeon® E3

Page 26 - Machine Vision Functions

32Supported Processors 2/3ECC MemoryECC (Error Correcting Code)1. Detects and corrects internal data corruption2. Provides improved data integrity and

Page 27 - Medical Record Management

33Supported Processors 3/3DesktopSUPPORTED TECHNOLOGYIntel® Xeon® E3-1275 v3Intel® Xeon® E3-1225 v3Intel® Xeon® E3-1268L v3INTEL® TURBO BOOST TECHNOLO

Page 28 - Drug and Package Inspection

34Power ConsumptionDesktopDL631-C226 ATXTBDDL310-C226 microATXTBD

Page 30 - High Computing Performance

36Development ScheduleDesktopKicked off on11.20121stES on05.20132ndES on09.2013MP on10.2013DVTEVT MVTDL631-C226ATXKicked off on03.20131stES on08.20132

Page 31 - Supported Processors 1/3

37Life CycleDesktopC226XeonE3-1200 v3C216XeonE3-1200 v2 2012 2013201420152016 201720182019Q1 2 3 4 Q1 2 3 4 Q1 32 4Q1 23 4Q123 4 Q123 4Q12 3 4Q1 2 3 4

Page 32 - Supported Processors 2/3

38Technical Information

Page 33 - Supported Processors 3/3

39Board LayoutDL631-C226 DL310-C226

Page 35 - Schedule

40Jumper SettingsDL631-C226DL310-C226

Page 36 - Development Schedule

41Block diagramDL631-C226 DL310-C226

Page 37 - Life Cycle

42Mechanical DrawingDL631-C226 DL310-C226

Page 38

43Competitor Analysis

Page 39 - Board Layout

44C226 ATX Motherboard ComparisonDFI DL631-C226Competitor IIMBA-C2260Competitor AASMB-784Processor 4th Gen Intel Xeon E3 Intel Xeon E3/ Intel Core i3

Page 40 - Jumper Settings

45C226 microATX Motherboard ComparisonDFI DL310-C226Competitor AAIMB-584Competitor TS5535Processor 4th Gen Intel Xeon E3 Intel Xeon E3/ Intel Core i7/

Page 41 - Block diagram

46Revision Control • Long Product Life Cycle www.dfi.com

Page 42 - Mechanical Drawing

5FeaturesXEONGigabit LANIntel I210 PCIe GLANIntel I217LM with iAMT9.0 GLAN PhyI/O6 COM4 USB 3.06 USB 2.08-bit DIOMemory4 DDR3/DDR3L DIMM up to 32GB, E

Page 43 - Competitor Analysis

6FeaturesXEONDL631-C226 ATX

Page 44

7SpecificationsXEONDL631-C226 ATXProcessorIntelXeon E3-1200 v3 seriesChipsetIntel C226Memory4 DDR3/DDR3L DIMM up to 32GB, ECC DisplayHDMI, DVI-ILAN2 I

Page 45 - Parallel 1 1 N/A

8FeaturesXEONGigabit LANIntel I210 PCIe GLANIntel I217LM with iAMT9.0 GLAN PhyI/O6 COM4 USB 3.08 USB 2.08-bit DIOMemory4 DDR3/DDR3L DIMM up to 32GB, E

Page 46

9FeaturesXEONDL310-C226 microATX

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